International Conference on Electronic and Advanced Materials 2023
VENUE:
Pulau Langkawi, Kedah
DATE:
23rd - 24th August 2023
ICEAM 2023 provides an excellent opportunity for intellectual discourse on demonstration of advances and research results in the fields of electronics and advanced materials. This conference brings together all academics, researchers, engineers and scientists around the world contributing to the global debate on these fields. There will be speakers and research experts from diverse research areas will share their recent research works and interest during the event. The program also target to build the substantial cooperation, networking and cooperation amongst the academicians, scientist, researchers and engineers from the fields related to the materials sciences and engineering.
Call
For
Papers
For
Papers
- Advanced materials
- Electronic materials
- Ceramic materials and geopolymer
- Bio-materials
- Magnetic materials
- Polymers and rubber
- Composites Metallurgy
- Modeling and simulation
- Lithium battery, fuel cells materials and energy storage
Publications:
All of the papers that are presented at ICEAM 2023 will be published in one of the following journals that are indexed by SCOPUS:
1. International Journal of Nanoelectronics and Materials (IJNeaM) - https://ijneam.unimap.edu.my/
2. Archives of Metallurgy and Materials - https://www.imim.pl/archives
All of the papers that are presented at ICEAM 2023 will be published in one of the following journals that are indexed by SCOPUS:
1. International Journal of Nanoelectronics and Materials (IJNeaM) - https://ijneam.unimap.edu.my/
2. Archives of Metallurgy and Materials - https://www.imim.pl/archives
REGISTRATION
Register now by clicking here.
IMPORTANT DATE
| SUBJECT | DATELINE |
| Full Paper Submission | 31 July 2023 |
| Notification of Acceptance | 1 week after paper submitted |
| Camera-Ready Submission | 1 week after receiving corrections |
| Full Payment | 14 August 2023 |
| Conference | 23 & 24 August 2023 |
FEE
| MYR | USD | |
| Local Participant | MYR 1,000 | - |
| International Participant | MYR 1,500 | USD 300 |
| Listener | MYR 200 | USD 50 |
Upload Proof of Payment here.
CONTACT US
For more enquiries, please email us at:
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Secretariat ICEAM 2023
Advanced Packaging Materials Research Group, CEGeoGTech
Faculty of Chemical Engineering & Technology, Universiti Malaysia Perlis (UniMAP)
TECHNICAL COMMITTEE
Organizer : Electronic Packaging & Thin Film Group, Center of Excellence Geopolymer and Green Technology (CEGeoGTech)
| Patron: | Assoc. Prof. Ir. Dr. Shayfull Zamree Abd Rahim |
| Advisor: | Assoc. Prof. Ir. Dr. Mohd Arif Anuar Mohd Salleh |
| Chairman: | Dr. Flora Somidin |
| Deputy Chairman: | Assoc. Prof. Dr. Dewi Suriyani Che Halin |
| Secretary: | 1. Assoc. Prof. Dr. Norainiza Saud |
| 2. Dr. Rita Mohd Said | |
| Treasurer: | Dr. Nur Izzati Muhammad Nadzri |
| Publication: | 1. Dr. Mohd Natashah Norizan |
| 2. Dr. Nurul Razliana Abdul Razak | |
| 3. Dr. Nur Syahirah Mohamad Zaimi | |
| 4. Dr. Ili Salwani Mohamad | |
| Event Manager & Logistic: | 1. Dr. Kamrosni Abdul Razak |
| 2. Ms. Aimi Noorliyana Hashim | |
| 3. Ms. Marliza Mostapha @ Zakaria | |
| Website & Technical: | 1. Mr. Muhammad Hafiz Zan @ Hazizi |
| 2. Mr. Lokman Hakim Ibrahim |